IEEE Electronics Packaging Society Photonics TC
Photonics TC and Reliability TC co-hosted the Reliability for Electronics and Photonics Packaging (REPP) Symposium 2020
Dec 6th, 2020 09:00 AM Eastern Daylight Time
Symposium on Reliability for Electronics and Photonics Packaging [more]
— reliability, failure modes and testing for integration of electronics and photonics (SiPh).
This symposium was held virtually, from Silicon Valley on November 12-13, 2020.
This symposiums focus was on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging.
Keynote Presentations that were made are listed below :
— Reliability Challenges for the Aerospace Sector and the Use of Commercial Off-The-Shelf Components (COTS), Chris Bailey, University of Greenwich
— Emerging Reliability Challenges: Solutions from Architecture to Layout for Large SoCs and 3DICs, Dr. Norman Chang, ANSYS;
— Reliability Challenges in Advanced Packaging, Dr. Subramanian Iyer, UCLA;
— Reliability Challenges for Electronics and Photonics Packaging for Deep Space, Dr. Reza Ghaffarian, JPL/NASA;
— Highly Reliable Silicon Photonics DWDM modules, Dr. Ranjani Muthiah, Inphi Corp;
— Electronics Quality and Reliability for Critical Applications that Adopt New Technologies and Designs, Dr. Alan Lucero, Intel Corp;
— Evolution of Data Center Optics Packaging Technology and Reliability Challenges, Dr. Omer Khayam, Google Technical Infrastructure;
— Silicon Photonics: State-Of-The-Art, Challenges, and Future Requirements, Dr. Vipul Patel, Cisco;
plus four sessions of papers.
Many of the keynote sessions and the session papers recordings can be viewed in the Program section of symposium.
All the sessions of the symposium were well attended. details for the symposium for 2021 will be coming out shortly. Keep a look-out for it.