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Future Packaging Vision Student Contest connected to ECTC 2020, please see the Activities/Events page for more details and award winners

IEEE EPS invited distinguished lecture of K. Bock at the Swiss EPS chapter on Electro-Optical Heterointegration, EMPA, Zurich, October, 24th 2019, Swiss

Special Industrial Workshop on electronics packaging for 5G, at 5G Summit & World Forum 2019, Dresden, September, 30th 2019, Germany

Presentation by K.Bock on Electro-Optical Heterointegration at the presidents panel of the ECTC 2019, Las Vegas, May, 28th, USA. Co-chairing the panel with the president Avi Bar-Cohen and organization of the first IEEE EPS Future Packaging Vision Contest with presentations of the winners at the presidents panel

Invited presentation of K. Bock by SEMI Europe on Electro-Optical Heterointegration the 3D & Systems Summit Dresden, January 29th, 2019, Germany


IEEE EPS technical committee chair of emerging technologies, Benson Chan Please use the email link onĀ  the page TC Emerging Technologies