Future Packaging Vision Contest

The president of the IEEE Electronic Packaging Society EPS and the technical chair of emerging technologies have launched the Future Packaging Vision Contest FPVC supporting young engineering professionals in industry and academia, offering them a high-visibility platform, firstly at the last years 2019 Electronic Components and Technology Conference, to present their visions of the future in their own style and mode of communication. Given the growing centrality of Packaging to electronic product development and in order to best serve the wider IEEE community, we are very keen to showcase electronics packaging visions and reachout to as many interested young professionals as possible and to reachout to as many interested young professionals as possible.

IEEE EPS very much believes that we need to more actively engage young professionals in the activities of our Society. We are endeavoring to provide them with opportunities to impact the path and future of Electronic Packaging and to prepare them for future leadership roles. We believe that this FPVC can help us to better listen to our young colleagues, so that we can learn about their thinking, insights, and priorities, as well as their modes of networking and communication.

All accepted student authors papers of ECTC2020 have been invited to submit a future packaging vision until the 21st of February 2020 in order to join the contest and  to provide the more generic description of their research field related to their work published in their ECTC 2020 paper and in relation to the IEEE EPS Heterogeneous Integration Roadmap HIR.

https://eps.ieee.org/technology/heterogeneous-integration-roadmap.html

The expert reviewer board consisting of representatives of the technical committees of IEEE EPS and ECTC has selected the 6 best future packaging visions out of the in total 15 high quality submissions. The best 3 submissions are awarded with a financial gift of the EPS President and their visions will be published on the EPS web-site. We are very glad to announce the winners of the IEEE EPS Future Packaging Vision Contest 2020 and we cordially invite you to join us in congratulating our six finalists and our three Award winners.

1st EPS FPV 2020 AWARD and US$ 1000 receives Arsalan Alam, Goutham Ezhilarasu, Randall Irwin, Samueli School of Engineering, University of California, Los Angeles, CA, USA, for the future packaging vision – FlexTrateTM: The Future of Flexible Packaging

This packaging vision covers the work completed on the FOWLP-based flexible packaging platform FlexTrateTM and the vision for the future of flexible packaging with this platform.

FlexTrateTM promises to be the first flexible and biocompatible platform using FOWLP allowing heterogeneous integration without die bonding. The FlexTrateTM platform is practically foldable, enabling form-free electronics. Adaptive patterning eliminates the die shift problem associated with FOWLP, enabling extremely high-density interconnect pitch (< 10 µm). The improved thermal conductivity of PDMS will enable a heat dissipation solution for high performance systems. FlexTrateTM will allow development of next generation high-performance flexible applications for example: Ultimate human machine interface platform with AI computing and Form-Free Electronics.

2nd EPS FPV 2020 AWARD and US$ 600 receives SivaChandra Jangam, Zhe Wan, and Niloofar Sharookzadeh, Sameuli School of Engineering, University of California, Los Angeles, for the future packaging vision – Packaging for Ultra-Large Scale Cognitive Systems

The scaling of cognitive systems is limited by interconnect density in packages today. Silicon Interconnect Fabric is a highly scalable, package-less, fine-pitch (<10 µm), heterogeneous integration platform to interconnect massive systems on wafers. The closely-packed dielet assembly helps achieve high bandwidth (>1Tbps/mm) at low latency (<30ps) and power (<0.2pJ/b). Therefore, Si-IF fine-grain computation helps to bridge the gap between cognitive systems and the human brain.

3rd IEEE EPS FPV 2020 AWARD and US$ 300 receives Sarthak Acharya, Embedded Internet System Lab (EISLAB), Department of Computer Science, Electrical and Space Engineering (SRT), Luleå Technical University, Sweden-97187 for the future packaging vision – An Additive Production approach for Microvias and Multilayered polymer substrate patterning of 2.5μm feature sizes

This future packaging vision is about a fully additive production approach, which is capable of producing 2.5 micrometer of L/S and microvias of 10 micrometer diameter. Results and process flow of the process is shown in the vision in detail. Future possibilities of the Work and its impact on the research community is presented and mapped with the EPS HIR.

IEEE EPS FPV 2020 – Place 4: Paritosh Rustogi    Next-Generation High-Channel-Density Implant-Connector Technology

This future packaging vision deals with the present day challenges in the packaging of implantable neural interface and their solution to the problem. Research focusses on development of a new implantable connector technology for high-channel application. The scalable implantable neural interface is scalable and supports future development of neural interfaces in channel number and density with its 2-D array design.

IEEE EPS FPV 2020 – Place 5: Lin Hou,    A novel iso-thermal intermetallic compound insertion bonding to improve throughput for sequential 3D stacking

This future packaging vision presents a developed stacking strategy, which allows significantly improvement of throughput for die-to-wafer stacking with a low cost for fine pitch solder joint. It also demonstrated the potential to perform the stacking at solid-state to avoid the solder bridge issue for fine pitch solder joint.

IEEE EPS FPV 2020 – Place 6: Cheol Kim Planar-Radial Structured TEC Device for Local Hot Spot Cooling in Mobile Electronics

This future packaging vision proposes an active cooling device using a solid-state thermoelectric cooler TEC with a unique planar-radial structure that can selectively cool only locally generated hot spots and minimize form factor designs with 2D structures, making this cooling device highly applicable to mobile devices.

Please see the full papers and presentations of the winners at the IEEE EPS ECTC 2020 digital event in June 2020. It is for free to register this year,

please visit: https://www.ectc.net/registration/index.cfm

We are very gratefull for your kind support of this initiative. Please do not hesitate to contact the TC chair of emerging technologies, if you have any questions or suggestions, please use the email link on the page TC Emerging Technologies