TC Emerging Technologies

Focuses on emerging, novel and unique material and packaging solutions. This  committee places an international focus on the development, characterization, and commercial support for packaging, assembly, and test infrastructure for key applications areas such as, Fluidic Systems, Optical Systems, Automotive Systems, Military Systems, Medical Systems, Remotely Operated Systems, Telecommunications and RF…

At present the EPS TC committee focusses on emerging technology topics like:

  • Bio and medical, flexible and stretchable electronics
  • Transformable electronics systems
  • Green / Bio-resorbable / Sustainable packaging
  • Paper electronics
  • Packaging for wife band gap devices
  • New assembly methods, self-assembly
  • Packaging for quantum computing and electro-optical integration
  • AI / ML and Computer vision for packaging
  • Space-hardened packaging technologies
  • Additive manufacturing and 3D printing
  • Cyber security on packaging level (Anti-tamper, cryptography)

Associated activities include:

  • The Electronic Components and Technology Conference (ECTC)
  • Other conferences and workshops with sessions or tracks with a focus on Emerging Concepts, MEMS and Sensor Integration
  • Special Sections in the IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Integrate young researchers into our community at IEEE EPS and at the ECTC conference, motivate them to bring in new and emerging topics for electronics packaging
  • Future Packaging Vision Contest started in  2019 and repeated in 2020, please see the activities  page

The technical committee is linked to activities in the technical program committee of ECTC for Emerging Technologies.  In order to optimize our reach-out we are interested in connecting with other working groups in related areas. This TC is open to coordinate its efforts with IMAPS, SMTA, iNEMI , ASME and SEMI as well as with the joint activity of the IEEE EPS Heterogeneous Integration Road Map (HIR) of IEEE EPS: https://eps.ieee.org/technology/heterogeneous-integration-roadmap.html

The key goals of this committee are to increase international awareness of the electronics packaging issues faced by the integration of  microsystems using emerging concepts and participate in activities toward solutions through:

  • Education, funding and strategy
  • Encouragement and support for the development of packaging infrastructure

For more information, to cooperate, to participate or to join our TC, or to volunteer for a member position in the TC emerging technologies and its  activities, send an email note  to:

Benson Chan, TC Chair for Emerging Technologies, Binghamton University, Integrated Electronics Engineering Center (IEEC), Vestal, NY, U.S.A.

Anyone can be an participating member of one or more of the EPS Society’s  technical committees TCs without belonging to the IEEE, but we would prefer if you join IEEE EPS.  You may also contact the webmaster concerning problems with reaching to this website the TC emerging technologies web-page. Regarding contend please contact Karlheinz Bock.

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